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Qianli QS03 Bumblebee Stencils BGA Reballing Planting Tin Plate For iPhone 7/7 Plus

Qianli QS03 Bumblebee Stencils BGA Reballing Planting Tin Plate For iPhone 7/7 Plus

$3.70 USD
$3.70 USD
Promotion Épuisé
Frais d'expédition calculés à l'étape de paiement.
1. Square hole design, precise position
2. High temperature resistance, fast and convenient
3. Excellent replacement of IC or BGA rework and reassembly
4. Made of high-quality steel, which is strong and durable, ensures a long service life
5. This product is small and strong
6. Compatible for iPhone 7/7 Plus


Specification:
Package Weight
One Package Weight 0.02kgs / 0.05lb
One Package Size 15cm * 9cm * 1cm / 5.91inch * 3.54inch * 0.39inch
Qty per Carton 600
Carton Weight 13.00kgs / 28.66lb
Carton Size 47cm * 38cm * 27cm / 18.5inch * 14.96inch * 10.63inch
Loading Container 20GP: 552 cartons * 600 pcs = 331200 pcs
40HQ: 1283 cartons * 600 pcs = 769800 pcs

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