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Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro
Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro
Prezzo di listino
$13.87 USD
Prezzo di listino
Prezzo scontato
$13.87 USD
Prezzo unitario
/
per
Spese di spedizione calcolate al check-out.
Impossibile caricare la disponibilità di ritiro
1. Strong magnetic adsorption, simple operation
2. Fast and convenient soldering
3. High temperature resistance and easy heat dissipation
4. Pewter can be planted accurately at mesh position
5. No damage to the motherboard, accurate positionin
2. Fast and convenient soldering
3. High temperature resistance and easy heat dissipation
4. Pewter can be planted accurately at mesh position
5. No damage to the motherboard, accurate positionin
Specification:
| Package Weight |
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