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MaAnt MY-228 Chip Cell Phone Repair Soldering BGA Flux Paste No Lead / Halogen Flux No Cleaning
MaAnt MY-228 Chip Cell Phone Repair Soldering BGA Flux Paste No Lead / Halogen Flux No Cleaning
Prezzo di listino
$3.82 USD
Prezzo di listino
Prezzo scontato
$3.82 USD
Prezzo unitario
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per
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1. Environmentally friendly material, lead-free and halogen-free, less smoke and less odor
2. Bright solder joints, no resistance, non-conductive
3. Less residue, less smoke, good flow performance
4. No short circuit, no need to clean, infinite conductivity
5. Scope of use: BGA/dense pin IC/mobile phone motherboard/computer motherboard/high-precision welding, etc.
6. Weight: about 20g
7. Size: about 12.7 x 2.9cm
Specification:
Package Weight |
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