TEC1-7103 8.4V/3A Low-power Semiconductor Refrigeration Plate

1. Chip model: TECI-7103SR
2. Temperature difference: 65 degrees Celsius
3. Voltage: 8.4V (MAX)
4. Recommended voltage: 5V
5. Assembly pressure: 85N/cm2
6. Refrigeration capacity: 13.5 (MAX)
7. Current: 3A (MAX)
8. Working environment: Temperature range -55~83 degrees Celsius (excessive ambient temperature will directly affect the refrigeration efficiency)
9. Packaging process: 704 silicone rubber seal or epoxy resin seal
10. Storage conditions ambient temperature -10~40 degrees Celsius
11. Device characteristics: red line positive electrode, black line negative electrode (literally the refrigeration surface, non-literally the heat dissipation surface)
12. When testing without heat dissipation, there will be a cooling effect. If the power is turned on, the power supply should be unplugged immediately within 1 second, otherwise the refrigeration plate will be easily burned.
13. A radiator or water-cooled heat dissipation device must be installed on the heat dissipation surface, otherwise it will burn.
14. Note: No matter whether it is water-cooled or air-cooled, thermal silicone grease must be applied
15. Wire specification: lead length 150mm
16. Dimensions: 30x30x4.3mm
17. Weight: 14 grams