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Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro

Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro

$13.87 USD
$13.87 USD
أُوكَازيُون نفذ
يتم احتساب الشحن عند الخروج.
1. Strong magnetic adsorption, simple operation
2. Fast and convenient soldering
3. High temperature resistance and easy heat dissipation
4. Pewter can be planted accurately at mesh position
5. No damage to the motherboard, accurate positionin


Specification:
Package Weight
One Package Weight 0.13kgs / 0.28lb
One Package Size 15cm * 11cm * 3cm / 5.91inch * 4.33inch * 1.18inch
Qty per Carton 80
Carton Weight 10.60kgs / 23.37lb
Carton Size 46cm * 32cm * 32cm / 18.11inch * 12.6inch * 12.6inch
Loading Container 20GP: 566 cartons * 80 pcs = 45280 pcs
40HQ: 1314 cartons * 80 pcs = 105120 pcs

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