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Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro
Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro
Обычная цена
$13.87 USD
Обычная цена
Цена со скидкой
$13.87 USD
Цена за единицу
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Стоимость доставки рассчитывается при оформлении заказа.
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1. Strong magnetic adsorption, simple operation
2. Fast and convenient soldering
3. High temperature resistance and easy heat dissipation
4. Pewter can be planted accurately at mesh position
5. No damage to the motherboard, accurate positionin
2. Fast and convenient soldering
3. High temperature resistance and easy heat dissipation
4. Pewter can be planted accurately at mesh position
5. No damage to the motherboard, accurate positionin
Specification:
| Package Weight |
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